產品服務

Processing

發布時間: 2016/08/03 08:50,類別: 產品服務

Self-developed key technologies for silicon carbide ingot & wafer processing: select the appropriate abrasive materials and appropriate processing recipe to slice, grind, polish and CMP silicon carbide ingots & wafers, obtained good flatness and surface quality silicon carbide wafers which are applicable for the use of epitaxial and device customers.

天科關鍵技術-1.jpg

天科關鍵技術-2.jpg

掃碼關注公眾號
聯系電話: 010-61256850
5分pk10骗局